High performance hard magnetic NdFeB thick films for integration into Micro-Electro-Mechanical-Systems

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dc.creatorDempsey, N. M.
dc.creatorWalther, Arnaud
dc.creatorMay, Frederic
dc.creatorGivord, Dominique
dc.creatorKhlopkov, Kirill
dc.creatorGutfleisch, Oliver
dc.date2007-03-29
dc.date.accessioned2026-07-07T07:54:46Z
dc.date.available2026-07-07T07:54:46Z
dc.description5$μ$m thick NdFeB films have been sputtered onto 100 mm Si substrates using high rate sputtering (18 $μ$m/h). Films were deposited at ≤ 500 C and then annealed at 750 C for 10 minutes. While films deposited at temperatures up to 450 C have equiaxed grains, the size of which decreases with increasing deposition temperature, the films deposited at 500 C have columnar grains. The out-of-plane remanent magnetization increases with deposition temperature, reaching a maximum value of 1.4 T, while the coercivity remains constant at about 1.6 T. The maximum energy product achieved (400 kJ/m3) is comparable to that of high-quality NdFeB sintered magnets.
dc.identifierhttps://arxiv.org/abs/cond-mat/0703785
dc.identifierhttp://arxiv.org/abs/cond-mat/0703785
dc.identifierApplied Physics Letters 90 (2007) 092509
dc.identifierdoi:10.1063/1.2710771
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/126736
dc.subjectMaterials Science
dc.titleHigh performance hard magnetic NdFeB thick films for integration into Micro-Electro-Mechanical-Systems
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