Characterization of Thermal Interface Materials to Support Thermal Simulation

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dc.creatorSchacht, R.
dc.creatorMay, D.
dc.creatorWunderle, B.
dc.creatorWittler, O.
dc.creatorGollhardt, A.
dc.creatorMichel, B.
dc.creatorReichl, H.
dc.date2007-09-12
dc.date.accessioned2026-07-07T08:29:06Z
dc.date.available2026-07-07T08:29:06Z
dc.descriptionIn this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effec-tive dissipation of heat. This can be achieved by the optimization of the system design with the help of simulation methods. The precision of these models relies also on the used material data. For the determi-nation of this data an experimental set-up for a static measurement is presented, which evaluates thermal conductivity and interface resistance of thermal inter-face materials (e.g. adhesive, solder, pads, or pastes). A qualitative structure-property correlation is pro-posed taking into account particle size, filler content and void formation at the interface based on high resolution FIB imaging. The paper gives an overview over the set-up and the measurement technique and discusses experimental and simulation results.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0709.1849
dc.identifierhttp://arxiv.org/abs/0709.1849
dc.identifierDans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/137850
dc.subjectMaterials Science
dc.titleCharacterization of Thermal Interface Materials to Support Thermal Simulation
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