Megasonic Enhanced Electrodeposition

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dc.creatorKaufmann, Jens Georg
dc.creatorDesmulliez, Marc
dc.creatorPrice, D.
dc.date2008-05-07
dc.date.accessioned2026-07-07T12:18:36Z
dc.date.available2026-07-07T12:18:36Z
dc.descriptionA novel way of filling high aspect ratio vertical interconnection (microvias) with an aspect ratio of >2:1 is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are possible for the manufacturing of interconnections and metal-based MEMS.
dc.descriptionSubmitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)
dc.identifierhttps://arxiv.org/abs/0805.0860
dc.identifierhttp://arxiv.org/abs/0805.0860
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/212467
dc.subjectOther Computer Science
dc.titleMegasonic Enhanced Electrodeposition
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