Microsystem Product Development

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Over the last decade the successful design and fabrication of complex MEMS (MicroElectroMechanical Systems), optical circuits and ASICs have been demonstrated. Packaging and integration processes have lagged behind MEMS research but are rapidly maturing. As packaging processes evolve, a new challenge presents itself, microsystem product development. Product development entails the maturation of the design and all the processes needed to successfully produce a product. Elements such as tooling design, fixtures, gages, testers, inspection, work instructions, process planning, etc., are often overlooked as MEMS engineers concentrate on design, fabrication and packaging processes. Thorough, up-front planning of product development efforts is crucial to the success of any project.
Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

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Other Computer Science

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http://salesiana.dossiersoluciones.com/handle/123456789/143004

Consulte el texto completo en el siguiente enlace:

https://arxiv.org/abs/0711.3274
 http://arxiv.org/abs/0711.3274
 Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)

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arXiv