Next Generation of TCAD Environments for MEMS Design
| dc.creator | Triltsch, Udo | |
| dc.creator | Büttgenbach, Stephanus | |
| dc.date | 2008-05-07 | |
| dc.date.accessioned | 2026-07-07T12:18:45Z | |
| dc.date.available | 2026-07-07T12:18:45Z | |
| dc.description | In this paper we present the latest version of the TCAD environment BICEP'S (Braunschweigs Integrated CAD-Environment for Product Planning and Process Simulation). By using a central process database, which allows the exchange of all relevant process data it is able to overcome many of the mentioned obstacles. The database and process planning tool can be used by process developers to document changes in process settings and the influence of such changes on the process result. This information can then be used by the designers to set-up a simulation file for a detailed analysis of the impact of such parameter changes on the requested design. This will be shown by the example of silicon etching using an atomistic etch simulator. | |
| dc.description | Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838) | |
| dc.identifier | https://arxiv.org/abs/0805.0926 | |
| dc.identifier | http://arxiv.org/abs/0805.0926 | |
| dc.identifier | Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008) | |
| dc.identifier.uri | http://salesiana.dossiersoluciones.com/handle/123456789/212521 | |
| dc.subject | Other Computer Science | |
| dc.title | Next Generation of TCAD Environments for MEMS Design | |
| dc.type | text |