Application of Ultraviolet Fluorescence in Wafer Surface Cleaning Analysis
| dc.creator | Pan, Zhongwei | |
| dc.creator | Chin, Richard | |
| dc.date | 1999-05-13 | |
| dc.date | 1999-06-17 | |
| dc.date.accessioned | 2026-07-07T03:13:27Z | |
| dc.date.available | 2026-07-07T03:13:27Z | |
| dc.description | Ultraviolet fluorescence (UVF) is introduced as a novel and versatile method for the determination of the contamination of metal impurities on silicon wafer surfaces. The results given demonstrate the usefulness of UVF for contamination control in silicon wafer processing. The experiments show some main characteristic peaks such as Fe, Cu, Ni and Na at room temperature. Compared with other surface sensitive techniques, the main advantages of UVF are low detection limits, simultaneous multi-element analysis and high sensitivity (up to 109 Fe/cm2). | |
| dc.description | 3 pages,6 figures | |
| dc.identifier | https://arxiv.org/abs/cond-mat/9905196 | |
| dc.identifier | http://arxiv.org/abs/cond-mat/9905196 | |
| dc.identifier.uri | http://salesiana.dossiersoluciones.com/handle/123456789/29303 | |
| dc.subject | Materials Science | |
| dc.title | Application of Ultraviolet Fluorescence in Wafer Surface Cleaning Analysis | |
| dc.type | text |