Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers

Simple item page
dc.creatorSzucs, Z.
dc.creatorNagy, G.
dc.creatorHodossy, S.
dc.creatorRencz, M.
dc.creatorPoppe, A.
dc.date2008-01-07
dc.date.accessioned2026-07-07T08:53:00Z
dc.date.available2026-07-07T08:53:00Z
dc.descriptionIn this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for Reliability information for MEMS designers. A high temperature test chamber and a chopper-stabilized read-out circuitry were designed and realized at BME - DED. Twenty thermal cycles of combined Temperature Cycle Test and Fatigue Vibration Test has been carried out on 5 samples. Statistical evaluation of the test results showed that degradation has started in 3 out of the 5 samples.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0801.1030
dc.identifierhttp://arxiv.org/abs/0801.1030
dc.identifierDans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/145473
dc.subjectGeneral Physics
dc.titleVibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers
dc.typetext

Files

Collections

arXiv