Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package

Simple item page
dc.creatorCzernohorsky, J.
dc.creatorMaj, B.
dc.creatorViering, Matthias
dc.creatorWright, L.
dc.creatorBalanon, G.
dc.date2008-01-07
dc.date.accessioned2026-07-07T08:52:58Z
dc.date.available2026-07-07T08:52:58Z
dc.descriptionSubject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0801.1003
dc.identifierhttp://arxiv.org/abs/0801.1003
dc.identifierDans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/145462
dc.subjectGeneral Physics
dc.titleEvaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package
dc.typetext

Files

Collections

arXiv