Void-induced cross slip of screw dislocations in fcc copper
| dc.creator | Hatano, Takahiro | |
| dc.creator | Kaneko, Tetsuya | |
| dc.creator | Abe, Yousuke | |
| dc.creator | Matsui, Hideki | |
| dc.date | 2007-10-31 | |
| dc.date | 2007-12-19 | |
| dc.date.accessioned | 2026-07-07T09:20:51Z | |
| dc.date.available | 2026-07-07T09:20:51Z | |
| dc.description | Pinning interaction between a screw dislocation and a void in fcc copper is investigated by means of molecular dynamics simulation. A screw dislocation bows out to undergo depinning on the original glide plane at low temperatures, where the behavior of the depinning stress is consistent with that obtained by a continuum model. If the temperature is higher than 300 K, the motion of a screw dislocation is no longer restricted to a single glide plane due to cross slip on the void surface. Several depinning mechanisms that involve multiple glide planes are found. In particular, a depinning mechanism that produces an intrinsic prismatic loop is found. We show that these complex depinning mechanisms significantly increase the depinning stress. | |
| dc.identifier | https://arxiv.org/abs/0710.5811 | |
| dc.identifier | http://arxiv.org/abs/0710.5811 | |
| dc.identifier | Physical Review B Vol.77, 064108 (2008) | |
| dc.identifier | doi:10.1103/PhysRevB.77.064108 | |
| dc.identifier.uri | http://salesiana.dossiersoluciones.com/handle/123456789/154857 | |
| dc.subject | Materials Science | |
| dc.subject | Soft Condensed Matter | |
| dc.title | Void-induced cross slip of screw dislocations in fcc copper | |
| dc.type | text |