Design issues of a variable thermal resistance
| dc.creator | Szekely, V. | |
| dc.creator | Mezosi, G. | |
| dc.date | 2007-09-12 | |
| dc.date.accessioned | 2026-07-07T08:29:05Z | |
| dc.date.available | 2026-07-07T08:29:05Z | |
| dc.description | Some years ago we have proposed a thermal mount with electronically variable thermal resistance [1]. In this earlier work the feasibility of such a structure has been demonstrated. Now we intend to realize this mount in a maturated form, suitable to the everyday use in the practice of package thermal qualification and modeling. The design of such a device raises a number of new questions and problems. The present paper is dealing with these problems and the possible solutions. | |
| dc.description | Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions) | |
| dc.identifier | https://arxiv.org/abs/0709.1836 | |
| dc.identifier | http://arxiv.org/abs/0709.1836 | |
| dc.identifier | Dans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006) | |
| dc.identifier.uri | http://salesiana.dossiersoluciones.com/handle/123456789/137845 | |
| dc.subject | Materials Science | |
| dc.title | Design issues of a variable thermal resistance | |
| dc.type | text |