Modeling of large area hot embossing

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dc.creatorWorgull, M.
dc.creatorKabanemi, K. K.
dc.creatorMarcotte, J. -P.
dc.creatorHétu, J. -F.
dc.creatorHeckele, M.
dc.date2008-02-21
dc.date.accessioned2026-07-07T09:22:18Z
dc.date.available2026-07-07T09:22:18Z
dc.descriptionToday, hot embossing and injection molding belong to the established plastic molding processes in microengineering. Based on experimental findings, a variety of microstructures have been replicated so far using the processes. However, with increasing requirements regarding the embossing surface and the simultaneous decrease of the structure size down into the nanorange, increasing know-how is needed to adapt hot embossing to industrial standards. To reach this objective, a German-Canadian cooperation project has been launched to study hot embossing theoretically by a process simulation and experimentally. The present publication shall report about the first results of the simulation - the modeling and simulation of large area replication based on an eight inch microstructured mold.
dc.descriptionSubmitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)
dc.identifierhttps://arxiv.org/abs/0802.3042
dc.identifierhttp://arxiv.org/abs/0802.3042
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/155330
dc.subjectOther Computer Science
dc.titleModeling of large area hot embossing
dc.typetext

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