A Two-Step Etching Method to Fabricate Nanopores in Silicon
| dc.creator | Wang, G. -J. | |
| dc.creator | Chen, W. -Z. | |
| dc.creator | Chang, K. J. | |
| dc.date | 2008-02-21 | |
| dc.date.accessioned | 2026-07-07T09:22:26Z | |
| dc.date.available | 2026-07-07T09:22:26Z | |
| dc.description | A cost effectively method to fabricate nanopores in silicon by only using the conventional wet-etching technique is developed in this research. The main concept of the proposed method is a two-step etching process, including a premier double-sided wet etching and a succeeding track-etching. A special fixture is designed to hold the pre-etched silicon wafer inside it such that the track-etching can be effectively carried out. An electrochemical system is employed to detect and record the ion diffusion current once the pre-etched cavities are etched into a through nanopore. Experimental results indicate that the proposed method can cost effectively fabricate nanopores in silicon. | |
| dc.description | Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing) | |
| dc.identifier | https://arxiv.org/abs/0802.3087 | |
| dc.identifier | http://arxiv.org/abs/0802.3087 | |
| dc.identifier | Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007) | |
| dc.identifier.uri | http://salesiana.dossiersoluciones.com/handle/123456789/155374 | |
| dc.subject | Other Computer Science | |
| dc.title | A Two-Step Etching Method to Fabricate Nanopores in Silicon | |
| dc.type | text |