3-D Self-Assembled Soi Mems: An Example of Multiphysics Simulation

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dc.creatorMendez, C.
dc.creatorLouis, C.
dc.creatorPaquay, S.
dc.creatorDe Vincenzo, P.
dc.creatorKlapka, I.
dc.creatorRochus, V.
dc.creatorIker, F.
dc.creatorAndré, Nicolas
dc.creatorRaskin, J. -P.
dc.date2007-11-21
dc.date.accessioned2026-07-07T08:45:35Z
dc.date.available2026-07-07T08:45:35Z
dc.descriptionMEMS devices are typical systems where multiphysics simulations are unavoidable. In this work, we present possible applications of 3-D self-assembled SOI (Silicon-on-Insulator) MEMS such as, for instance, thermal actuators and flow sensors. The numerical simulations of these microsystems are presented. Structural and thermal parts have to be strongly coupled for correctly describing the fabrication process and for simulating the behavior of these 3-D SOI MEMS.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0711.3277
dc.identifierhttp://arxiv.org/abs/0711.3277
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/143007
dc.subjectOther Computer Science
dc.title3-D Self-Assembled Soi Mems: An Example of Multiphysics Simulation
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