Thermal Conductivity of Thermally-Isolating Polymeric and Composite Structural Support Materials Between 0.3 and 4 K

Simple item page
dc.creatorRunyan, M. C.
dc.creatorJones, W. C.
dc.date2008-06-11
dc.date.accessioned2026-07-07T09:56:09Z
dc.date.available2026-07-07T09:56:09Z
dc.descriptionWe present measurements of the low-temperature thermal conductivity of a number of polymeric and composite materials from 0.3 to 4 K. The materials measured are Vespel SP-1, Vespel SP-22, unfilled PEEK, 30% carbon fiber-filled PEEK, 30% glass-filled PEEK, carbon fiber Graphlite composite rod, Torlon 4301, G-10/FR-4 fiberglass, pultruded fiberglass composite, Macor ceramic, and graphite rod. These materials have moderate to high elastic moduli making them useful for thermally-isolating structural supports.
dc.descriptionAccepted for publication in the journal Cryogenics
dc.identifierhttps://arxiv.org/abs/0806.1921
dc.identifierhttp://arxiv.org/abs/0806.1921
dc.identifierdoi:10.1016/j.cryogenics.2008.06.002
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/166879
dc.subjectAstrophysics
dc.subjectInstrumentation and Detectors
dc.titleThermal Conductivity of Thermally-Isolating Polymeric and Composite Structural Support Materials Between 0.3 and 4 K
dc.typetext

Files

Collections

arXiv