Molecular Dynamics Study of a Thermal Expansion Coefficient: Ti Bulk with an Elastic Minimum Image Method

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dc.creatorHundur, Yakup
dc.creatorHippler, Rainer
dc.creatorGuvenc, Ziya B.
dc.date2007-04-18
dc.date.accessioned2026-07-07T07:57:03Z
dc.date.available2026-07-07T07:57:03Z
dc.descriptionLinear thermal expansion coefficient (TEC) and specific heat of Ti bulk is investigated by means of molecular dynamics simulation. Elastic Minimum Image Convention of periodic boundary conditions is introduced to allow the bulk to adjust its size according to the new temporarily fixed temperature. The TEC and the specific heat of Ti are compared to the available theoretical and experimental data.
dc.description4 pages, 3 figures
dc.identifierhttps://arxiv.org/abs/0704.2371
dc.identifierhttp://arxiv.org/abs/0704.2371
dc.identifierChin. Phys. Lett. 23 (2006), 1068-1071
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/127543
dc.subjectComputational Physics
dc.subjectAtomic and Molecular Clusters
dc.titleMolecular Dynamics Study of a Thermal Expansion Coefficient: Ti Bulk with an Elastic Minimum Image Method
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