Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package

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dc.creatorKoo, Ja-Myeong
dc.creatorJung, Seung-Boo
dc.date2007-11-21
dc.date.accessioned2026-07-07T08:45:39Z
dc.date.available2026-07-07T08:45:39Z
dc.descriptionInterfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the substrate over an underlying Cu pad: electroplated Ni/Au (hereafter E-NG), electroless Ni/immersion Au (hereafter ENIG), immersion Ag (hereafter I-Ag) and organic solderability preservative (hereafter OSP). During bonding, continuous AuIn2, Ni3(Sn,In)4 and Cu6(Sn,In)5 intermetallic compound (IMC) layers were formed at the solder/E-NG, solder/ENIG and solder/OSP interface, respectively. The interfacial reactions between the solder and I-Ag substrate during bonding resulted in the formation of Cu6(Sn,In)5 and Cu(Sn,In)2 IMCs with a minor Ag element. The In-48Sn/I-Ag solder joint showed the best shear properties among the four solder joints after bonding, whereas the solder/ENIG solder joint exhibited the weakest mechanical integrity.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0711.3306
dc.identifierhttp://arxiv.org/abs/0711.3306
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/143027
dc.subjectOther Computer Science
dc.titleEffect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package
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