Temperature measurement of sub-micrometric ICs by scanning thermal microscopy

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dc.creatorGomès, S.
dc.creatorChapuis, Po
dc.creatorNepveu, F.
dc.creatorTrannoy, N.
dc.creatorVolz, S.
dc.creatorCharlot, B.
dc.creatorTessier, Gilles
dc.creatorDilhaire, S.
dc.creatorCretin, Bernard
dc.creatorVairac, Pascal
dc.date2007-11-28
dc.date.accessioned2026-07-07T08:45:52Z
dc.date.available2026-07-07T08:45:52Z
dc.descriptionSurface temperature measurements were performed with a Scanning Thermal Microscope mounted with a thermoresistive wire probe of micrometrSurface temperature measurements were performed with a Scanning Thermal Microscope mounted with a thermoresistive wire probe of micrometric size. A CMOS device was designed with arrays of resistive lines 0.35$μ$m in width. The array periods are 0.8micron and 10micron to study the spatial resolution of the SThM. Integrated Circuits with passivation layers of micrometric and nanometric thicknesses were tested. To enhance signal-to-noise ratio, the resistive lines were heated with an AC current. The passivation layer of nanometric thickness allows us to distinguish the lines when the array period is 10micron. The results raise the difficulties of the SThM measurement due to the design and the topography of ICs on one hand and the size of the thermal probe on the other hand.ic size. A CMOS device was designed with arrays of resistive lines 0.35$μ$m in width. The array periods are 0.8micron and 10micron to study the spatial resolution of the SThM. Integrated Circuits with passivation layers of micrometric and nanometric thicknesses were tested. To enhance signal-to-noise ratio, the resistive lines were heated with an AC current. The passivation layer of nanometric thickness allows us to distinguish the lines when the array period is 10micron. The results raise the difficulties of the SThM measurement due to the design and the topography of ICs on one hand and the size of the thermal probe on the other hand.
dc.identifierhttps://arxiv.org/abs/0711.4530
dc.identifierhttp://arxiv.org/abs/0711.4530
dc.identifierIEEE Transactions on Components and Packaging Technologies 30, 3 (2007) 424-431
dc.identifierdoi:10.1109/TCAPT.2007.901748
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/143098
dc.subjectClassical Physics
dc.titleTemperature measurement of sub-micrometric ICs by scanning thermal microscopy
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