Molecular Dynamics Simulation Study on the Melting of Ultra-thin Copper Nanowires

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dc.creatorKang, Jeong Won
dc.creatorHwang, Ho Jung
dc.date2002-03-14
dc.date.accessioned2026-07-07T02:44:41Z
dc.date.available2026-07-07T02:44:41Z
dc.descriptionWe have investigated the melting behavior of ultra-thin copper nanowires using classical molecular dynamics simulations. The caloric curves of cylindrical multi-shell copper nanowires showed an insight into the specific phase transition. The melting temperature of copper nanowires is linearly proportional with the number of atoms per layer. When nanowires have almost the same number of atoms per layer regardless of the initial structures, the melting temperatures of nanowires are much the same.
dc.description13 pages including 1 table and 3 figures. be appeared in JKPS
dc.identifierhttps://arxiv.org/abs/cond-mat/0203295
dc.identifierhttp://arxiv.org/abs/cond-mat/0203295
dc.identifierJournal of the Korean Physical Society Vol. 40 no. 5 pp.946-948 May 2002
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/19030
dc.subjectMaterials Science
dc.titleMolecular Dynamics Simulation Study on the Melting of Ultra-thin Copper Nanowires
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