Reflow Soldering of Surface Mount Electronic Components in a Laboratory

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dc.creatorErickson, Christopher J.
dc.creatorDurfee, Dallin S.
dc.date2008-12-31
dc.date.accessioned2026-07-07T12:23:43Z
dc.date.available2026-07-07T12:23:43Z
dc.descriptionWe present a basic tutorial for implementing surface mount technology in lab-built scientific instruments. We discuss the advantages and disadvantages of using surface mount chips. We also describe methods for the development and prototyping of surface mount circuitry in home-built electronics. The method of soldering surface mount components in a common toaster oven is described. We provide advice from our own experience in developing this technology, and argue that surface mount technology is often preferable to using leaded components when building large circuits, and is essential if the desired component characteristics are only available in surface mount packages.
dc.description6 pages, 4 figures
dc.identifierhttps://arxiv.org/abs/0901.0136
dc.identifierhttp://arxiv.org/abs/0901.0136
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/214086
dc.subjectInstrumentation and Detectors
dc.titleReflow Soldering of Surface Mount Electronic Components in a Laboratory
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