A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices

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dc.creatorChen, H.
dc.creatorHsu, L.
dc.creatorWei, X.
dc.date2008-01-07
dc.date.accessioned2026-07-07T08:52:58Z
dc.date.available2026-07-07T08:52:58Z
dc.descriptionThis paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient temperature, and may be used for temperature control or heating if the direction of current flow is reversed. By using a monolithic process to increase the number of thermoelectric couples, the proposed solid-state cooling technology can be combined with traditional air cooling, liquid cooling, and phase-change cooling to yield greater heat flux and provide better cooling capability.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0801.0997
dc.identifierhttp://arxiv.org/abs/0801.0997
dc.identifierDans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/145459
dc.subjectGeneral Physics
dc.titleA Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices
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