Condensation and growth of Kirkendall voids in intermetallic compounds

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dc.creatorWeinberg, Kerstin
dc.creatorBoehme, Thomas
dc.date2008-03-03
dc.date.accessioned2026-07-07T09:24:20Z
dc.date.available2026-07-07T09:24:20Z
dc.descriptionA model for the simulation of Kirkendall voiding in metallic materials is presented based on vacancy diffusion, elastic-plastic and rate-dependent deformation of spherical voids. Starting with a phenomenological explanation of the Kirkendall effect we briefly discuss the consequences on the reliability of microelectronics. A constitutive model for void nucleation and growth is presented, which can be used to predict the temporal development of voids in solder joints during thermal cycling. We end with exemplary numerical studies and discuss the potential of the results for the failure analysis of joining connections.
dc.description11 pages, 13 Figures, 2 Tables, submitted to Elsevier
dc.identifierhttps://arxiv.org/abs/0803.0196
dc.identifierhttp://arxiv.org/abs/0803.0196
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/156060
dc.subjectMaterials Science
dc.titleCondensation and growth of Kirkendall voids in intermetallic compounds
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