Mechanical Fatigue on Gold MEMS Devices: Experimental Results

dc.creatorDe Pasquale, Giorgio
dc.creatorSomà, Aurelio
dc.creatorBallestra, Alberto
dc.date2008-05-07
dc.date.accessioned2026-07-07T12:18:48Z
dc.date.available2026-07-07T12:18:48Z
dc.descriptionThe effect of mechanical fatigue on structural performances of gold devices is investigated. The pull-in voltage of special testing micro-systems is monitored during the cyclical load application. The mechanical collapse is identified as a dramatic loss of mechanical strength of the specimen. The fatigue limit is estimated through the stair-case method by means of the pull-in voltage measurements. Measurements are performed by means of the optical interferometric technique.
dc.descriptionSubmitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)
dc.identifierhttps://arxiv.org/abs/0805.0945
dc.identifierhttp://arxiv.org/abs/0805.0945
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/212537
dc.subjectOther Computer Science
dc.titleMechanical Fatigue on Gold MEMS Devices: Experimental Results
dc.typetext

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