Structural, magnetic and mechanical properties of 5 $μ$m thick SmCo films for use in Micro-Electro-Mechanical-Systems
| dc.creator | Walther, Arnaud | |
| dc.creator | Khlopkov, Kirill | |
| dc.creator | Gutfleisch, Oliver | |
| dc.creator | Givord, Dominique | |
| dc.creator | Dempsey, N. M. | |
| dc.date | 2008-04-12 | |
| dc.date.accessioned | 2026-07-07T12:18:17Z | |
| dc.date.available | 2026-07-07T12:18:17Z | |
| dc.description | 5$μ$m thick SmCo films were deposited onto Si substrates using triode sputtering. A study of the influence of deposition temperature (Tdep <= 600 degrees C) on the structural, magnetic and mechanical properties has shown that optimum properties (highest degree of in-plane texture, maximum in-plane coercivity and remanence (1.3 and 0.8 T, respectively), no film peel-off) are achieved for films deposited at the relatively low temperature of 350 degrees C. This temperature is compatible with film integration into Micro-Electro-Mechanical-Systems (MEMS). The deposition rate was increased from 3.6 to 18 $μ$m/h by increasing the surface area of the target from 7 to 81 cm2. Mechanically stable films could be prepared by deposition onto pre-patterned films or deposition through holes in a mask. | |
| dc.identifier | https://arxiv.org/abs/0804.1992 | |
| dc.identifier | http://arxiv.org/abs/0804.1992 | |
| dc.identifier | Journal of Applied Physics 103 (2008) 043911 | |
| dc.identifier | doi:10.1063/1.2840131 | |
| dc.identifier.uri | http://salesiana.dossiersoluciones.com/handle/123456789/212360 | |
| dc.subject | Materials Science | |
| dc.title | Structural, magnetic and mechanical properties of 5 $μ$m thick SmCo films for use in Micro-Electro-Mechanical-Systems | |
| dc.type | text |