Fabrication of Switches on Polymer-Based by Hot Embossing

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dc.creatorChien, Chao-Heng
dc.creatorYu, Hui-Min
dc.date2007-11-21
dc.date.accessioned2026-07-07T08:45:43Z
dc.date.available2026-07-07T08:45:43Z
dc.descriptionIn MEMS technology, most of the devices are fabricated on glass or silicon substrate. However, this research presents a novel manufacture method that is derived from conventional hot embossing technology to fabricate the electrostatic switches on polymer material. The procedures of fabrication involve the metal deposition, photolithography, electroplating, hot embossing and hot embed techniques. The fundamental concept of the hot embed technology is that the temperature should be increased above Tg of polymer, and the polymer becomes plastic and viscous and could be molded. According to the fundamental concept, the metal layer on the silicon/glass substrate could be embedded into polymer material during the hot embossing process. Afterward, the metal layer is bonded together with the polymer after removing the substrate in the de-embossing step. Finally, the electrostatic switch is fabricated on polymethylmethacrylate(PMMA) material to demonstrate the novel method.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0711.3334
dc.identifierhttp://arxiv.org/abs/0711.3334
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/143051
dc.subjectOther Computer Science
dc.titleFabrication of Switches on Polymer-Based by Hot Embossing
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