High Density out-of-Plane Microprobe Array

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dc.creatorH., Huang C. H. Huang C.
dc.creatorTsou, Chingfu
dc.creatorLai, Tenghsien
dc.date2008-05-07
dc.date.accessioned2026-07-07T12:18:43Z
dc.date.available2026-07-07T12:18:43Z
dc.descriptionMEMS technology has been developed rapidly in the last few years. More and more special micro structures were discussed in several publications. However, all of the structures were produced by consist of the three fundamental structures, which included bridge, cantilever and membrane structures. Even the more complex structures were no exception. The cantilever with the property of simple design and easy fabrication among three kinds of fundamental structure, therefore, it was popular used in the design of MEMS device.
dc.descriptionSubmitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)
dc.identifierhttps://arxiv.org/abs/0805.0911
dc.identifierhttp://arxiv.org/abs/0805.0911
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/212509
dc.subjectOther Computer Science
dc.titleHigh Density out-of-Plane Microprobe Array
dc.typetext

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