Numerical Investigation of Laser-Assisted Nanoimprinting on a Copper Substrate from a Perspective of Heat Transfer Analysis
| dc.creator | Jen, Chun-Ping | |
| dc.date | 2008-05-07 | |
| dc.date.accessioned | 2026-07-07T12:18:42Z | |
| dc.date.available | 2026-07-07T12:18:42Z | |
| dc.description | The technique of laser-assisted nanoimprinting lithography (LAN) has been proposed to utilize an excimer laser to irradiate through a quartz mold and melts a thin polymer film on the substrate for micro- to nano-scaled fabrications. In the present study, the novel concept of that copper was adopted as the substrate instead of silicon, which is conventionally used, was proposed. The micro/nano structures on the copper substrate could be fabricated by chemical/electrochemical etching or electroforming ; following by the patterns have been transferred onto the substrate using LAN process. Alternatives of the substrate materials could lead versatile applications in micro/nano-fabrication. To demonstrate the feasibility of this concept numerically, this study introduced optical multiple reflection theory to perform both analytical and numerical modeling during the process and to predict the thermal response theoretically. | |
| dc.description | Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838) | |
| dc.identifier | https://arxiv.org/abs/0805.0897 | |
| dc.identifier | http://arxiv.org/abs/0805.0897 | |
| dc.identifier | Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008) | |
| dc.identifier.uri | http://salesiana.dossiersoluciones.com/handle/123456789/212498 | |
| dc.subject | Other Computer Science | |
| dc.title | Numerical Investigation of Laser-Assisted Nanoimprinting on a Copper Substrate from a Perspective of Heat Transfer Analysis | |
| dc.type | text |