Micro Embossing of Ceramic Green Substrates for Micro Devices

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dc.creatorShan, X. -C.
dc.creatorLing, S. H.
dc.creatorMaw, H. P.
dc.creatorLu, C. W.
dc.creatorLam, Y. C.
dc.date2008-05-07
dc.date.accessioned2026-07-07T12:18:37Z
dc.date.available2026-07-07T12:18:37Z
dc.descriptionMultilayered ceramic substrates with embedded micro patterns are becoming increasingly important, for example, in harsh environment electronics and microfluidic devices. Fabrication of these embedded micro patterns, such as micro channels, cavities and vias, is a challenge. This study focuses on the process of patterning micro features on ceramic green substrates using micro embossing. A ceramic green tape that possessed near-zero shrinkage in the x-y plane was used, six layers of which were laminated as the embossing substrate. The process parameters that impact on the pattern fidelity were investigated and optimized in this study. Micro features with line-width as small as several micrometers were formed on the ceramic green substrates. The dynamic thermo-mechanical analysis indicated that extending the holding time at certain temperature range would harden the green substrates with little effect on improving the embossing fidelity. Ceramic substrates with embossed micro patterns were obtain d after co-firing. The embedded micro channels were also obtained by laminating the green tapes on the embossed substrates.
dc.descriptionSubmitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)
dc.identifierhttps://arxiv.org/abs/0805.0862
dc.identifierhttp://arxiv.org/abs/0805.0862
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/212469
dc.subjectOther Computer Science
dc.titleMicro Embossing of Ceramic Green Substrates for Micro Devices
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