Thermal Transient Characterization of Packaged Thin Film Microcoolers

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dc.creatorFukutani, K.
dc.creatorSingh, R.
dc.creatorShakouri, A.
dc.date2007-09-12
dc.date.accessioned2026-07-07T08:29:04Z
dc.date.available2026-07-07T08:29:04Z
dc.descriptionA network identification by deconvolution (NID) method is applied to the thermal transient response of packaged and unpackaged microcoolers. A thin film resistor on top of the device is used as the heat source and the temperature sensor. The package and the bonding thermal resistances can be easily identified by comparing structure functions. High-speed coplanar probes are used to achieve a short time resolution of roughly 100ns in the transient temperature response. This is used to separate the thermal properties of the thin film from the substrate. The obtained thermal resistances of the buffer layer and Silicon substrate are consistent with the theoretical calculations. In order to estimate the superlattice thermal resistance and separate it from the thin SiNx layer deposited underneath the thin film resistive sensor, an order of magnitude faster thermal transient response is needed.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0709.1817
dc.identifierhttp://arxiv.org/abs/0709.1817
dc.identifierDans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/137837
dc.subjectMaterials Science
dc.titleThermal Transient Characterization of Packaged Thin Film Microcoolers
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