Development of EHD Ion-Drag Micropump for Microscale Electronics Cooling Systems

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dc.creatorLee, C. K.
dc.creatorRobinson, A. J.
dc.creatorChing, C. Y.
dc.date2008-01-07
dc.date.accessioned2026-07-07T08:52:58Z
dc.date.available2026-07-07T08:52:58Z
dc.descriptionIn this investigation, the numerical simulation of electrohydrodynamic (EHD) ion-drag micropumps with micropillar electrode geometries have been performed. The effect of micropillar height and electrode spacing on the performance of the micropumps was investigated. The performance of the EHD micropump improved with increased applied voltage and decreased electrode spacing. The optimum micropillar height for the micropump with electrode spacing of 40$μ$m and channel height of 100$μ$m at 200V was 40$μ$m, where a maximum mass flow rate of 0.18g/min was predicted. Compared to that of planar electrodes, the 3D micropillar electrode geometry enhanced the overall performance of the EHD micropumps.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0801.1001
dc.identifierhttp://arxiv.org/abs/0801.1001
dc.identifierDans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/145461
dc.subjectGeneral Physics
dc.titleDevelopment of EHD Ion-Drag Micropump for Microscale Electronics Cooling Systems
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