Design and Development of Novel Electroplating Spring Frame Mems Structure Specimens for the Microtensile Testing of Thin Film Materials

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dc.creatorLin, Ming-Tzer
dc.creatorTong, Chi-Jia
dc.creatorChiang, Chung-Hsun
dc.date2007-11-21
dc.date.accessioned2026-07-07T08:45:38Z
dc.date.available2026-07-07T08:45:38Z
dc.descriptionMicroelectromechanical systems (MEMS) technologies are developing rapidly with increasing study of the design, fabrication and commercialization of microscale systems and devices. Accurate mechanical properties are important for successful design and development of MEMS. We have demonstrated here a novel electroplating spring frame MEMS Structure Specimen integrates pin-pin align holes, misalignment compensate spring structure frame, load sensor beam and freestanding thin film. The specimen can be fit into a specially designed microtensile apparatus which is capable of carrying out a series of tests on sub-micro scale freestanding thin films.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0711.3300
dc.identifierhttp://arxiv.org/abs/0711.3300
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/143022
dc.subjectOther Computer Science
dc.titleDesign and Development of Novel Electroplating Spring Frame Mems Structure Specimens for the Microtensile Testing of Thin Film Materials
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