Combination of Thermal Subsystems Modelled by Rapid Circuit Transformation

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dc.creatorGerstenmaier, Y. C.
dc.creatorKiffe, W.
dc.creatorWachutka, G.
dc.date2008-01-07
dc.date.accessioned2026-07-07T08:52:50Z
dc.date.available2026-07-07T08:52:50Z
dc.descriptionThis paper will deal with the modeling-problem of combining thermal subsystems (e.g. a semiconductor module or package with a cooling radiator) making use of reduced models. The subsystem models consist of a set of Foster-type thermal equivalent circuits, which are only behavioral models. A fast al-gorithm is presented for transforming the Foster-type circuits in Cauer-circuits which have physical behavior and therefore allow for the construction of the thermal model of the complete system. Then the set of Cauer-circuits for the complete system is transformed back into Foster-circuits to give a simple mathematical representation and applicability. The transfor-mation algorithms are derived in concise form by use of recur-sive relations. The method is exemplified by modeling and measurements on a single chip IGBT package mounted on a closed water cooled radiator. The thermal impedance of the complete system is constructed from the impedances of the sub-systems, IGBT-package and radiator, and also the impedance of the package can be inferred from the measured impedance of the complete system.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0801.0817
dc.identifierhttp://arxiv.org/abs/0801.0817
dc.identifierDans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/145413
dc.subjectGeneral Physics
dc.titleCombination of Thermal Subsystems Modelled by Rapid Circuit Transformation
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