Packaging of RF Mems Switching Functions on Alumina Substrate

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dc.creatorKhatib, M. -K. El
dc.creatorPothier, A.
dc.creatorBlondy, P.
dc.date2007-11-21
dc.date.accessioned2026-07-07T08:45:38Z
dc.date.available2026-07-07T08:45:38Z
dc.descriptionRecently the strong demands in wireless communication requires expanding development for the application of RF MEMS (Radio Frequency micro electro mechanical systems) sensing devices such as micro-switches, tunable capacitors because it offers lower power consumption, lower losses, higher linearity and higher Q factors compared with conventional communications components. To accelerate commercialisation of RF MEMS products, development for packaging technologies is one of the most critical issues should be solved beforehand.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0711.3297
dc.identifierhttp://arxiv.org/abs/0711.3297
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/143019
dc.subjectOther Computer Science
dc.titlePackaging of RF Mems Switching Functions on Alumina Substrate
dc.typetext

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