Dynamic Thermal Analysis of a Power Amplifier

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dc.creatorBanaszczyk, J.
dc.creatorDe Mey, G.
dc.creatorJanicki, M.
dc.creatorNapieralski, A.
dc.creatorVermeersch, B.
dc.creatorKawka, P.
dc.date2007-09-12
dc.date.accessioned2026-07-07T08:29:04Z
dc.date.available2026-07-07T08:29:04Z
dc.descriptionThis paper presents dynamic thermal analyses of a power amplifier. All the investigations are based on the transient junction temperature measurements performed during the circuit cooling process. The presented results include the cooling curves, the structure functions, the thermal time constant distribution and the Nyquist plot of the thermal impedance. The experiments carried out demonstrated the influence of the contact resistance and the position of the entire cooling assembly on the obtained results.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0709.1818
dc.identifierhttp://arxiv.org/abs/0709.1818
dc.identifierDans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/137838
dc.subjectMaterials Science
dc.titleDynamic Thermal Analysis of a Power Amplifier
dc.typetext

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