Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array
| dc.creator | Bognar, Gy. | |
| dc.creator | Szekely, V. | |
| dc.creator | Rencz, M. | |
| dc.date | 2007-11-21 | |
| dc.date.accessioned | 2026-07-07T08:45:42Z | |
| dc.date.available | 2026-07-07T08:45:42Z | |
| dc.description | In this paper the feasibility study of an IR sensor card is presented. The methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation is introduced. With the proposed method the IR radiation-distribution of boards from the close proximity of the sensor card is monitored in quasi real-time. The proposed method is enabling in situ IR measurement among operating cards of a system e.g. in a rack. | |
| dc.description | Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions) | |
| dc.identifier | https://arxiv.org/abs/0711.3324 | |
| dc.identifier | http://arxiv.org/abs/0711.3324 | |
| dc.identifier | Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006) | |
| dc.identifier.uri | http://salesiana.dossiersoluciones.com/handle/123456789/143042 | |
| dc.subject | Other Computer Science | |
| dc.title | Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array | |
| dc.type | text |