Integrated RF MEMS/CMOS Devices

dc.creatorMansour, R. R.
dc.creatorFouladi, S.
dc.creatorBakeri-Kassem, M.
dc.date2008-05-07
dc.date.accessioned2026-07-07T12:18:36Z
dc.date.available2026-07-07T12:18:36Z
dc.descriptionA maskless post-processing technique for CMOS chips is developed that enables the fabrication of RF MEMS parallel-plate capacitors with a high quality factor and a very compact size. Simulations and measured results are presented for several MEMS/CMOS capacitors. A 2-pole coupled line tunable bandpass filter with a center frequency of 9.5 GHz is designed, fabricated and tested. A tuning range of 17% is achieved using integrated variable MEMS/CMOS capacitors with a quality factor exceeding 20. The tunable filter occupies a chip area of 1.2 x 2.1 mm2.
dc.descriptionSubmitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)
dc.identifierhttps://arxiv.org/abs/0805.0858
dc.identifierhttp://arxiv.org/abs/0805.0858
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/212465
dc.subjectOther Computer Science
dc.titleIntegrated RF MEMS/CMOS Devices
dc.typetext

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