A Coupled Thermoreflectance Thermography Experimental System and Ultra-Fast Adaptive Computational Engine for the Complete Thermal Characterization of Three-Dimensional Electronic Devices: Validation
| dc.creator | Raad, Peter E. | |
| dc.creator | Komarov, Pavel L. | |
| dc.creator | Burzo, M. | |
| dc.date | 2007-09-12 | |
| dc.date.accessioned | 2026-07-07T08:29:07Z | |
| dc.date.available | 2026-07-07T08:29:07Z | |
| dc.description | This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface temperature scanning approach with a CCD camera-based approach. As before, the thermo-reflectance thermography system is used to non-invasively measure with submicron resolution the 2D surface temperature field of an activated device. The measured temperature field is then used as input for an ultra-fast inverse computational solution to fully characterize the thermal behavior of the complex three-dimensional device. For the purposes of this investigation, basic micro-heater devices were built, activated, and measured. In order to quantitatively validate the coupled experimental-computational system, the system was used to extract geometric features of a known device, thus assessing the system's ability to combine measured experimental results and computations to fully characterize complex 3D electronic devices. | |
| dc.description | Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions) | |
| dc.identifier | https://arxiv.org/abs/0709.1851 | |
| dc.identifier | http://arxiv.org/abs/0709.1851 | |
| dc.identifier | Dans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006) | |
| dc.identifier.uri | http://salesiana.dossiersoluciones.com/handle/123456789/137852 | |
| dc.subject | Materials Science | |
| dc.title | A Coupled Thermoreflectance Thermography Experimental System and Ultra-Fast Adaptive Computational Engine for the Complete Thermal Characterization of Three-Dimensional Electronic Devices: Validation | |
| dc.type | text |