Towards a Methodology for Analysis of Interconnect Structures for 3D-Integration of Micro Systems

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dc.creatorSchneider, P.
dc.creatorReitz, S.
dc.creatorWilde, A.
dc.creatorElst, G.
dc.creatorSchwarz, P.
dc.date2008-02-21
dc.date.accessioned2026-07-07T09:22:27Z
dc.date.available2026-07-07T09:22:27Z
dc.descriptionFunctional aspects as well as the influence of integration technology on the system behavior have to be considered in the 3D integration design process of micro systems. Therefore, information from different physical domains has to be provided to designers. Due to the variety of structures and effects of different physical domains, efficient modeling approaches and simulation algorithms have to be combined. The paper describes a modular approach which covers detailed analysis with PDE solvers and model generation for system level simulation.
dc.descriptionSubmitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)
dc.identifierhttps://arxiv.org/abs/0802.3089
dc.identifierhttp://arxiv.org/abs/0802.3089
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/155376
dc.subjectOther Computer Science
dc.titleTowards a Methodology for Analysis of Interconnect Structures for 3D-Integration of Micro Systems
dc.typetext

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