Fabrication of MEMS Resonators in Thin SOI
| dc.creator | Grogg, D. | |
| dc.creator | Badila-Ciressan, Nicoleta Diana | |
| dc.creator | Ionescu, Adrian Mihai | |
| dc.date | 2008-02-21 | |
| dc.date.accessioned | 2026-07-07T09:22:18Z | |
| dc.date.available | 2026-07-07T09:22:18Z | |
| dc.description | A simple and fast process for micro-electromechanical (MEM) resonators with deep sub-micron transduction gaps in thin SOI is presented in this paper. Thin SOI wafers are important for advanced CMOS technology and thus are evaluated as resonator substrates for future co-integration with CMOS circuitry on a single chip. As the transduction capacitance scales with the resonator thickness, it is important to fabricate deep sub-micron trenches in order to achieve a good capacitive coupling. Through the combination of conventional UV-lithography and focused ion beam (FIB) milling the process needs only two lithography steps, enabling therefore a way for fast prototyping of MEM-resonators. Different FIB parameters and etching parameters are compared in this paper and their effect on the process are reported. | |
| dc.description | Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing) | |
| dc.identifier | https://arxiv.org/abs/0802.3040 | |
| dc.identifier | http://arxiv.org/abs/0802.3040 | |
| dc.identifier | Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007) | |
| dc.identifier.uri | http://salesiana.dossiersoluciones.com/handle/123456789/155328 | |
| dc.subject | Other Computer Science | |
| dc.title | Fabrication of MEMS Resonators in Thin SOI | |
| dc.type | text |