An Integrated Circuit Compatible Compact Package for Thermal Gas Flowmeters

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dc.creatorBruschi, P.
dc.creatorNurra, V.
dc.date2008-02-21
dc.date.accessioned2026-07-07T09:22:22Z
dc.date.available2026-07-07T09:22:22Z
dc.descriptionAn original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of a thermal procedure. By this approach it is possible to selectively convey the fluid flow to reduced chip areas, avoiding contact with the pads. Fabrication and testing of a very compact flow sensor is described.
dc.descriptionSubmitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)
dc.identifierhttps://arxiv.org/abs/0802.3062
dc.identifierhttp://arxiv.org/abs/0802.3062
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/155350
dc.subjectOther Computer Science
dc.titleAn Integrated Circuit Compatible Compact Package for Thermal Gas Flowmeters
dc.typetext

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