2026-07-072026-07-07http://salesiana.dossiersoluciones.com/handle/123456789/212467A novel way of filling high aspect ratio vertical interconnection (microvias) with an aspect ratio of >2:1 is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are possible for the manufacturing of interconnections and metal-based MEMS.Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)Other Computer Sciencetext