2026-07-072026-07-07http://salesiana.dossiersoluciones.com/handle/123456789/145462Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)General Physicstext