2026-07-072026-07-07http://salesiana.dossiersoluciones.com/handle/123456789/143006Advances in material processing such as silicon micromachining are opening the way to vacuum microelectronics. Two-dimensional vacuum components can be fabricated using the microsystems processes. We developed such devices using a single metal layer and silicon micromachining by DRIE. The latter technological step has significant impact on the characteristics of the vacuum components. This paper presents a brief summary of electron emission possibilities and the design leading to the fabrication of a lateral field emission diode. First measurement results and the aging of the devices are also discussed.Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)Other Computer Sciencetext