2026-07-072026-07-07http://salesiana.dossiersoluciones.com/handle/123456789/155382Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to build smart sensor clusters for the precise detection of movements in all spatial dimensions requires a large toolbox of interconnect technologies, each with its own constraints regarding the total process integration. Specific challenges described in this paper are post-CMOS feedthroughs, front-to-front die contact arrays, vacuum-compliant lateral interconnect and fine-pitch solder balling to finally form a Chip-Scale System-in-Package (CSSiP).Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)Other Computer Sciencetext