2026-07-072026-07-07http://salesiana.dossiersoluciones.com/handle/123456789/155350An original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of a thermal procedure. By this approach it is possible to selectively convey the fluid flow to reduced chip areas, avoiding contact with the pads. Fabrication and testing of a very compact flow sensor is described.Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)Other Computer Sciencetext