A Novel Contact Resistance Model of Anisotropic Conductive Film for FPD Packaging

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In this research, a novel contact resistance model for the flat panel display (FPD) packaging based on the within layer parallel and between layers series resistance concepts was proposed. The FJ2530 anisotropic conductive films (ACF) by Sony Inc. containing the currently smallest 3micron conductive particles was used to conduct the experiments to verify the accuracy of the proposed model. Calculated resistance of the chip-on-glass (COG) packaging by the proposed model is 0.163Ω. It is found that the gold bump with 0.162Ωresistance play the major role of the overall resistance. Although the predicted resistance by the proposed model is only one third of the experimentally measured value, it has been three-fold improvement compared to the existing models.
Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

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Other Computer Science

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http://salesiana.dossiersoluciones.com/handle/123456789/143025

Consulte el texto completo en el siguiente enlace:

https://arxiv.org/abs/0711.3304
 http://arxiv.org/abs/0711.3304
 Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)

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arXiv