A Novel Contact Resistance Model of Anisotropic Conductive Film for FPD Packaging

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dc.creatorWang, Gou-Jen
dc.creatorLin, Yi-Chin
dc.creatorLin, Gwo-Sen
dc.date2007-11-21
dc.date.accessioned2026-07-07T08:45:39Z
dc.date.available2026-07-07T08:45:39Z
dc.descriptionIn this research, a novel contact resistance model for the flat panel display (FPD) packaging based on the within layer parallel and between layers series resistance concepts was proposed. The FJ2530 anisotropic conductive films (ACF) by Sony Inc. containing the currently smallest 3micron conductive particles was used to conduct the experiments to verify the accuracy of the proposed model. Calculated resistance of the chip-on-glass (COG) packaging by the proposed model is 0.163Ω. It is found that the gold bump with 0.162Ωresistance play the major role of the overall resistance. Although the predicted resistance by the proposed model is only one third of the experimentally measured value, it has been three-fold improvement compared to the existing models.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0711.3304
dc.identifierhttp://arxiv.org/abs/0711.3304
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/143025
dc.subjectOther Computer Science
dc.titleA Novel Contact Resistance Model of Anisotropic Conductive Film for FPD Packaging
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