Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films

Yao, H. B.; Bouville, M.; Chi, D. Z.; Sun, H. P.; Pan, X. Q.; Srolovitz, D. J.; Mangelinck, D.

Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films

Authors

Description

Germanosilicides, especially those formed on compressive substrates, are less stable than silicides against agglomeration. By studying the solid-state reaction of Ni thin film on strained Si0.8Ge0.2(001), we show that nickel germanosilicide is different from nickel silicide and nickel germanide in several respects: the grains are smaller and faceted, the groove angle is sharper, and dealloying takes place. The germanium out-diffusion creates a stress in the film which favors grooving and agglomeration.
13 pages, 4 figures