Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films

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dc.creatorYao, H. B.
dc.creatorBouville, M.
dc.creatorChi, D. Z.
dc.creatorSun, H. P.
dc.creatorPan, X. Q.
dc.creatorSrolovitz, D. J.
dc.creatorMangelinck, D.
dc.date2006-05-18
dc.date.accessioned2026-07-07T07:40:48Z
dc.date.available2026-07-07T07:40:48Z
dc.descriptionGermanosilicides, especially those formed on compressive substrates, are less stable than silicides against agglomeration. By studying the solid-state reaction of Ni thin film on strained Si0.8Ge0.2(001), we show that nickel germanosilicide is different from nickel silicide and nickel germanide in several respects: the grains are smaller and faceted, the groove angle is sharper, and dealloying takes place. The germanium out-diffusion creates a stress in the film which favors grooving and agglomeration.
dc.description13 pages, 4 figures
dc.identifierhttps://arxiv.org/abs/cond-mat/0605451
dc.identifierhttp://arxiv.org/abs/cond-mat/0605451
dc.identifierElectrochem. Solid-State Lett., Volume 10, Issue 2, pp. H53-H55 (2007)
dc.identifierdoi:10.1149/1.2400726
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/121890
dc.subjectMaterials Science
dc.titleInterplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films
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