Through Silicon Vias as Enablers for 3D Systems

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This special session on 3D TSV's will highlight some of the fabrication processes and used technologies to create vias from the frontside of an active circuit to its backside and potential implementation solutions to form complex systems leveraging these novel possibilities. General techniques for via formation are discussed as well as advanced integration solutions leveraging the power of 3D TSV's.
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)

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Other Computer Science

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http://salesiana.dossiersoluciones.com/handle/123456789/212516

Consulte el texto completo en el siguiente enlace:

https://arxiv.org/abs/0805.0918
 http://arxiv.org/abs/0805.0918
 Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)

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arXiv