Through Silicon Vias as Enablers for 3D Systems

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dc.creatorJung, E.
dc.creatorOstmann, Andreas
dc.creatorRamm, Peter
dc.creatorWolf, Jürgen
dc.creatorToepper, Michael
dc.creatorWiemer, Maik
dc.date2008-05-07
dc.date.accessioned2026-07-07T12:18:45Z
dc.date.available2026-07-07T12:18:45Z
dc.descriptionThis special session on 3D TSV's will highlight some of the fabrication processes and used technologies to create vias from the frontside of an active circuit to its backside and potential implementation solutions to form complex systems leveraging these novel possibilities. General techniques for via formation are discussed as well as advanced integration solutions leveraging the power of 3D TSV's.
dc.descriptionSubmitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)
dc.identifierhttps://arxiv.org/abs/0805.0918
dc.identifierhttp://arxiv.org/abs/0805.0918
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/212516
dc.subjectOther Computer Science
dc.titleThrough Silicon Vias as Enablers for 3D Systems
dc.typetext

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